Blar i TKD - Institutt for maskin, elektronikk og kjemi på tidsskrift "Journal of Micromechanics and Microengineering"
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Wafer-level Au–Au bonding in the 350–450 ◦C temperature range
(Journal article; Journal article; Peer reviewed, 2014)Metal thermocompression bonding is a hermetic wafer-level packaging technology that facilitates vertical integration and shrinks the area used for device sealing. In this paper, Au–Au bonding at 350, 400 and 450 °C has ...