Browsing ODA Open Digital Archive by Author "Poppe, Erik"

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    • Wafer-level Au–Au bonding in the 350–450 ◦C temperature range 

      Tofteberg, Hannah Rosquist; Schjølberg-Henriksen, Kari; Fasting, Eivind Johan; Moen, Alexander Stene; Taklo, Maaike Margrete Visser; Poppe, Erik; Simensen, Christian Julius (Journal article; Journal article; Peer reviewed, 2014)
      Metal thermocompression bonding is a hermetic wafer-level packaging technology that facilitates vertical integration and shrinks the area used for device sealing. In this paper, Au–Au bonding at 350, 400 and 450 °C has ...